Enplas announced that it will showcase advanced optical connectivity and thermal-management technologies for AI data centers at ECOC 2026 in Málaga, Spain. The company will present solutions supporting 800Gbps and 1.6Tbps optical transceivers, as well as Co-Packaged Optics (CPO) technologies aimed at next-generation AI data-center infrastructure. Enplas will also demonstrate cold-plate solutions for CPU and GPU cooling and laser-based glass processing technologies.
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